Lower deposition temperatures, lower energy and process gas consumption, faster production and combination of new materials for wide-bandgap semiconductors. ELEMENT 3—5 leaps epitaxy to the next level.
Novel design combined with our innovative in-line manufacturing concept is the basis for scalable mass-production and significant increase in efficiency.
ELEMENT 3—5 sets new standards in the manufacturing process mode of semiconductors. For this purpose, we set up the wafer vertically and thus achieve the greatest possible homogeneity and particle-free production.
Our unique process method enables deposition of monocrystalline structures of the highest quality at temperatures below 300 °C. Thus, the production is much more environmentally friendly, energy-saving and also more cost-efficient than the conventional process techniques.
We are opening up completely new opportunities for the semiconductor industry. Due to process temperatures below 300 °C, temperature-sensitive substrates can be deployed, materials beyond the 3rd and 5th main groups can be deposited and new stacks can be built in.
ELEMENT 3—5 technology relies on intelligent plasma and renders the use of toxic gases in semiconductor production obsolete. Operation and maintenance is much easier and, together with energy savings of up to 90 percent in production, we significantly reduce the environmental impact.